{"id":685,"date":"2016-05-13T18:03:04","date_gmt":"2016-05-13T18:03:04","guid":{"rendered":"https:\/\/smtworldwide.asia\/?page_id=685"},"modified":"2016-05-13T18:03:04","modified_gmt":"2016-05-13T18:03:04","slug":"se500-x","status":"publish","type":"page","link":"https:\/\/smtworldwide.asia\/index.php\/se500-x\/","title":{"rendered":"SE500-X\u2122"},"content":{"rendered":"

Product Description<\/h3>\n

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\"SE500-X5-350x355\"<\/p>\n<\/div>\n

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With SE500-X\u2122\u00a0– 100% 3D<\/strong> solder paste inspection system, CyberOptics pushes inspection speed to the highest level possible. The SE500-X\u2122\u00a0is capable of inspecting the most demanding assemblies with 80cm\u00b2\/sec inspection speed without compromising on measurement accuracy and repeatability.<\/p>\n

Building on CyberOptics\u2019 reputation as the provider of solder paste inspection systems with industry-leading volume accuracy, the SE500-X\u2122\u00a0can inspect pad sizes down to 01005 component size (150 x 150 \u00b5m) while keeping up with ever-increasing line speeds.<\/p>\n

SE500-X\u2122\u00a0is designed to help you achieve high quality solder joints in your SMT process through accurate volume measurement of each solder paste deposit every single time.<\/p>\n<\/div>\n<\/div>\n

<\/div>Make an order<\/span><\/a>
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Downloads<\/h3>\n

 <\/p>\nDatasheet<\/span><\/a>\n

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 <\/p>\nGC-PowerPlace\u2122 Offline Programming Software<\/span><\/a>\n

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 <\/p>\nePM-SPI Offline Programming Software<\/span><\/a>\n

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Details<\/h3>\n
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