{"id":677,"date":"2016-05-13T17:56:56","date_gmt":"2016-05-13T17:56:56","guid":{"rendered":"https:\/\/smtworldwide.asia\/?page_id=677"},"modified":"2016-05-13T17:56:56","modified_gmt":"2016-05-13T17:56:56","slug":"se500-d","status":"publish","type":"page","link":"https:\/\/smtworldwide.asia\/index.php\/se500-d\/","title":{"rendered":"SE500-D\u2122"},"content":{"rendered":"

Product Description<\/h3>\n

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The SE500-D\u2122 Dual Lane 3-D SPI System<\/strong> takes solder paste inspection to the next level with its flexible conveyor setup design and large board capability comparable with major SMT suppliers. SE500-D\u2122 combines innovative design with on-the-fly inspection technology using strobed white light to inspect even the most demanding assemblies at > 80 cm\u00b2\/sec with zero compromise on measurement accuracy and repeatability.<\/p>\n

With SE500-D\u2122 you can maximize production utilization and transform your production process to achieve high quality solder joints through accurate volume measurement of solder paste deposits.<\/p>\n<\/div>\n<\/div>\n

<\/div>Make an order<\/span><\/a>
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Downloads<\/h3>\n

 <\/p>\nDatasheet<\/span><\/a>\n

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 <\/p>\nGC-PowerPlace Offline Programming Software Brochure<\/span><\/a>\n

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 <\/p>\nePM-SPI Offline Programming Software Brochure<\/span><\/a>\n

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Details<\/h3>\n
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