{"id":1225,"date":"2017-06-17T16:33:02","date_gmt":"2017-06-17T16:33:02","guid":{"rendered":"https:\/\/smtworldwide.asia\/?page_id=1225"},"modified":"2017-06-17T16:33:02","modified_gmt":"2017-06-17T16:33:02","slug":"semiconductor-packaging","status":"publish","type":"page","link":"https:\/\/smtworldwide.asia\/index.php\/semiconductor-packaging\/","title":{"rendered":"Semiconductor Packaging"},"content":{"rendered":"<h3>Description<\/h3>\n<p class=\"p1\">\n<div class=\"one_half\">\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone  wp-image-1226\" src=\"https:\/\/smtworldwide.asia\/wp-content\/uploads\/2017\/06\/semicon_NO_packaging.jpg\" alt=\"semicon_NO_packaging\" width=\"533\" height=\"340\" srcset=\"https:\/\/smtworldwide.asia\/wp-content\/uploads\/2017\/06\/semicon_NO_packaging.jpg 1208w, https:\/\/smtworldwide.asia\/wp-content\/uploads\/2017\/06\/semicon_NO_packaging-300x191.jpg 300w, https:\/\/smtworldwide.asia\/wp-content\/uploads\/2017\/06\/semicon_NO_packaging-768x490.jpg 768w, https:\/\/smtworldwide.asia\/wp-content\/uploads\/2017\/06\/semicon_NO_packaging-1024x654.jpg 1024w\" sizes=\"auto, (max-width: 533px) 100vw, 533px\" \/><\/p>\n<\/div>\n<div class=\"one_half last_column\">\n<p class=\"p1\"><span class=\"s1\"><b>ECORELTM<\/b><\/span><span class=\"s2\"> and <\/span><span class=\"s1\"><b>ECOFRECTM<\/b><\/span><span class=\"s2\"> soldering materials for processes such as ball attach (CSP, BGA), flip chip and wafer bumping used in the manufacturing of power semiconductors, flash memories, micromodules and hybrid assemblies.<\/span><\/p>\n<p class=\"p1\"><\/div>\n<div class=\"divider\"><\/div>\n<p class=\"p1\"><span class=\"s1\"><b>Die attach<\/b><\/span><\/p>\n<p class=\"p2\"><span class=\"s2\"><b>ECORELTM<\/b><\/span><span class=\"s1\"> solder paste exhibits good wettability on Ni, NiP, Cu lead frames with low percentage of solder voids and excellent flux residue cleanability.<\/span><\/p>\n<p class=\"p2\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone  wp-image-1229\" src=\"https:\/\/smtworldwide.asia\/wp-content\/uploads\/2017\/06\/semicon_die_attach.jpg\" alt=\"semicon_die_attach\" width=\"482\" height=\"87\" \/><\/p>\n<p class=\"p1\"><span class=\"s1\"><b>Defluxing<\/b><\/span><\/p>\n<p class=\"p2\"><span class=\"s1\">Cleaning solutions after die attach for power semiconductors, especially when packaging is done using solder paste.<\/span><\/p>\n<p class=\"p2\"><span class=\"s1\">For hybrid packaging, our solutions can integrate water and solvent based chemistries to efficiently removed organic and inorganic residues remaining on the substrate.<\/span><\/p>\n<p class=\"p2\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone  wp-image-1230\" src=\"https:\/\/smtworldwide.asia\/wp-content\/uploads\/2017\/06\/Image10.jpg\" alt=\"Image10\" width=\"334\" height=\"397\" \/><\/p>\n<p class=\"p2\"><span class=\"s1\">\u00a0<\/span><\/p>\n<p class=\"p2\">\n","protected":false},"excerpt":{"rendered":"<p>Description Die attach ECORELTM solder paste exhibits good wettability on Ni, NiP, Cu lead frames with low percentage of solder voids and excellent flux residue cleanability. Defluxing Cleaning solutions after die attach for power semiconductors, especially when packaging is done using solder paste. For hybrid packaging, our [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-1225","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/smtworldwide.asia\/index.php\/wp-json\/wp\/v2\/pages\/1225","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/smtworldwide.asia\/index.php\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/smtworldwide.asia\/index.php\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/smtworldwide.asia\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/smtworldwide.asia\/index.php\/wp-json\/wp\/v2\/comments?post=1225"}],"version-history":[{"count":0,"href":"https:\/\/smtworldwide.asia\/index.php\/wp-json\/wp\/v2\/pages\/1225\/revisions"}],"wp:attachment":[{"href":"https:\/\/smtworldwide.asia\/index.php\/wp-json\/wp\/v2\/media?parent=1225"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}